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Fully Automated Wet Bench for Batch Processes
Applications
- Saw Damage Removal
- Pre Clean
- Texturization
- PSG Removal
Throughput
- Texturization: up to > 2.000 W./h
- PSG Removal: up to > 4.000 W./h
Substrate Sizes, Batch Sizes
- 156 x 156 mm, upgradeable to 210 x 210 mm
- Wafer thickness min. 150 µm; 100 Wafers or 200 Wafers / Batch
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