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Fully Automated Wet Bench
Applications
- Cleaning (SC1 and SC2)
- Etching (Nitride etch, SiO2 Etch; Si -Etch); drying (advanced IPA dryer, spin dryer; advanced IPA dryer drain type)
- Dry in - Dry out or Dry in - Wet out
Throughput
- Up to 300 Wafers per hour (dependant on configuration)
Substrate Sizes, Batch Sizes
- 2 x 25 Wafers 6” (4”, 5” optional)
- 2 x 25 Wafers 8”
- 1 x 50 Wafers 8” (Low Mass Carriers)
- 1 x 50 Wafers 12” (Low Mass Carrier)
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